Numerical analysis of disbonding in sandwich structures using 1D finite elements
Author:
Publisher
Elsevier BV
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference28 articles.
1. Interfacial fatigue crack growth in foam core sandwich structures;Shipsha;Fatigue Fract Eng Mater Struct (Print),1999
2. Relation between interfacial fracture toughness and mode-mixity in honeycomb core sandwich composites;Grau;J Sandwich Struct Mater,2006
3. Fatigue debond growth in sandwich structures loaded in mixed mode bending (mmb);Quispitupa;ECCM13,2008
4. Fatigue of undamaged and damaged honeycomb sandwich beams;Burman;J Sandwich Struct Mater,2000
5. On the analysis of a mixed mode bending sandwich specimen for debond fracture characterization;Quispitupa;Eng Fract Mech,2009
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