Surface and subsurface damage of reaction-bonded silicon carbide induced by electrical discharge diamond grinding-Reference-Cited by-同舟云学术

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Surface and subsurface damage of reaction-bonded silicon carbide induced by electrical discharge diamond grinding

Published:2020-07 Issue: Volume:154 Page:103564
ISSN:0890-6955
Container-title:International Journal of Machine Tools and Manufacture
language:en
Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Rao Xiaoshuang,Zhang Feihu,Lu Yanjun,Luo Xichun,Chen Fumin

Funder

National Science and Technology Major Project of China

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference38 articles.

1. Theoretical study on removal rate and surface roughness in grinding a RB-SiC mirror with a fixed abrasive;Wang;Appl. Optic.,2009

2. Profile error compensation in ultra-precision grinding of aspheric surfaces with on-machine measurement;Chen;Int. J. Mach. Tool Manufact.,2010

3. Prediction model of form error influenced by grinding wheel wear in grinding process of large-scale aspheric surface with SiC ceramics;Liu;Int. J. Adv. Manuf. Technol.,2017

4. Study on ductile-mode mirror grinding of SiC ceramic freeform surface using an elliptical torus-shaped diamond wheel;Xie;J. Mater. Process. Technol.,2015

5. Experimental investigation on electrical discharge diamond grinding of RB-SiC ceramics;Rao;Int. J. Adv. Manuf. Technol.,2018

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