Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM-Reference-Cited by-同舟云学术

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Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM

Published:2014-01 Issue: Volume:76 Page:13-20
ISSN:0890-6955
Container-title:International Journal of Machine Tools and Manufacture
language:en
Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Liew Pay Jun,Yan Jiwang,Kuriyagawa Tsunemoto

Funder

Universiti Teknikal Malaysia Melaka

Ministry of Higher Education, Malaysia

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference31 articles.

1. On the effect of electrodischarge machining parameters on the fatigue life of AISI D6 tool steel;Abu Zeid;Journal of Materials Processing Technology,1997

2. A study on the fine-finish die-sinking micro-EDM of tungsten carbide using different electrode materials;Jahan;Journal of Materials Processing Technology,2009

3. Machining of three-dimensional microstructures in silicon by electro-discharge machining;Reynaerts;Sensors and Actuators A,1998

4. Debris and consequences in micro electric discharge machining of micro-holes;Ekmekci;International Journal of Machine Tools and Manufacture,2013

5. Effects of ultrasonic vibrations in micro electro-discharge machining of microholes;Yeo;Journal of Micromechanics and Microengineering,1999

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