A macroscopic mechanical model of the wire sawing process-Reference-Cited by-同舟云学术

A macroscopic mechanical model of the wire sawing process

Published:2011-09 Issue:9 Volume:51 Page:711-720
ISSN:0890-6955
Container-title:International Journal of Machine Tools and Manufacture
language:en
Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Liedke T.,Kuna M.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference21 articles.

1. Vibration analysis of wiresaw manufacturing processes and wafer surface measurements;Kao;NSF Design and Manufacturing Grantees Conference,1998

2. Technology and research of slurry wiresaw manufacturing systems in wafer slicing with free abrasive machining;Kao;International Journal of Advanced Manufacturing Systems,2004

3. Microscopic mechanisms of multi-wire sawing;Funke;Freiberger Forschungshefte,2004

4. Basic mechanisms and models of multi-wire sawing;Moeller;Advanced Engineering Materials,2004

5. Elasto-hydrodynamic interaction in the free abrasive wafer slicing using a wiresaw: modeling and finite element analysis;Bhagavat;Journal of Tribology,2000

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