Scalable and energy efficient wireless inter chip interconnection fabrics using THz-band antennas

Author:

Saxena Sagar,Manur Deekshith Shenoy,Mansoor Naseef,Ganguly Amlan

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

Artificial Intelligence,Computer Networks and Communications,Hardware and Architecture,Theoretical Computer Science,Software

Reference49 articles.

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5. J. Kye, Y. Woo, J. Zeng, H. Levinson, A. Wehbi, P. Hang, V. Ton-That, V. Kanagala, D. Yu, D. Blackwell, A. Beece, S. Gao, S. Thangaraju, R. Alapati, S. Samavedam, Challenges of analog and I/O scaling in 10 nm SoC technology and beyond, in: 2014 IEEE International Electron Devices Meeting, San Francisco, CA, 2014, pp. 18.3.1–18.3.4.

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