Ion milling-induced ESD damage during MR head fabrication

Author:

Olson David H

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Biotechnology,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Zap! another MR head bites the dust;Wallash;Data Storage,1998

2. C.F. Lam, E. Salhi, S. Chim, Characterization of ESD damaged magnetoresistive recording heads, 1997 EOS/ESD Symposium Proceedings, pp. 386–397.

3. A. Wallash, D. Smith, Electromagnetic interference (EMI) damage to giant magnetoresistive (GMR) recording heads, 1998 EOS/ESD Symposium Proceedings, pp. 368–374.

4. T. Cheung, “Direct charging” charge device model testing of magnetoresistive recording heads, 1997 EOS/ESD Symposium Proceedings, pp. 398–404.

5. Sample charging of insulators with rough surfaced during Auger electron spectroscopy analysis;Park;J. Vac. Sci. Technol. A,1997

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2. What is Electrical Overstress? - Analysis and Conclusions;Microelectronics Reliability;2015-05

3. Wafer charging in process equipment and its relationship to GMR heads charging damage;IEEE Transactions on Electronics Packaging Manufacturing;2001-04

4. Wafer charging in process equipment and its relationship to GMR heads charging damage;Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)

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