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2. A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks;Lee;IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A,1996
3. Millimeter-wave imaging for nondestructive evaluation of materials;Gopalsami;Materials Evaluation,1994
4. Microwave near-field imaging with open-ended waveguide — comparison with other techniques of nondestructive testing;Diener;Research in Nondestructive Evaluation,1995
5. Microwave imaging of thick composite with defects;Qaddoumi;Materials Evaluation,1995