Wavelet analysis based deconvolution to improve the resolution of scanning acoustic microscope images for the inspection of thin die layer in semiconductor-Reference-Cited by-同舟云学术

Wavelet analysis based deconvolution to improve the resolution of scanning acoustic microscope images for the inspection of thin die layer in semiconductor

Published:2002-12 Issue:8 Volume:35 Page:549-557
ISSN:0963-8695
Container-title:NDT & E International
language:en
Short-container-title:NDT & E International

Author:

Jhang Kyungyoung,Jang Hyoseong,Park Byungil,Ha Job,Park Ikkeun,Kim Kyungsuk

Publisher

Elsevier BV

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science

Reference8 articles.

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3. Deconvolution techniques for ultrasonic imaging of adhesive joints;McRae;Mater Eval,1990

4. An introduction to wavelets;IEEE Comput Sci Engng,1995

5. An introduction to random vibrations, spectral and wavelet analysis;Newland,1993

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