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Effect of grain boundary on lattice thermal conduction of tungsten revealed by molecular dynamics simulations

  • Published:2013-05 Issue: Volume:303 Page:4-8
  • ISSN:0168-583X
  • Container-title:Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
  • language:en
  • Short-container-title:Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms

Author:

Fu Baoqin,Lai Wensheng,Yuan Yue,Xu Haiyan,Liu Wei

Funder

National Magnetic Confinement Fusion Science Program of China

the National Nature Science Foundation of China

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference21 articles.

1. Calculation and analysis of lattice thermal conductivity in tungsten by molecular dynamics;Fu;J. Nucl. Mater.,2012

2. Cracking failure study of ITER-reference tungsten grade under single pulse thermal shock loads at elevated temperatures;Hirai;J. Nucl. Mater.,2009

3. Molecular dynamics studies of temperature effects on low energy helium bombardments on tungsten surfaces;Li;J. Nucl. Mater.,2012

4. Recrystallization and grain growth behavior of rolled tungsten under VDE-like short pulse high heat flux loads;Yuan;J. Nucl. Mater.,2012

5. Behavior of tungsten with exposure to deuterium plasmas;Luo;Nucl. Instrum. Methods Phys. Res. Sect. B,2009
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