Processing, characterization and properties of copper-based composites strengthened by low amount of alumina particles
Author:
Funder
Ministry of Education, Science and Technological Development of the Republic of Serbia
Publisher
Elsevier BV
Subject
General Chemical Engineering
Reference35 articles.
1. High electrical conductivity Cu-based alloys. Part I;Jovanović;J. Metall. MJoM,2009
2. Copper matrix SiC and Al2O3 particulate composites by powder metallurgy technique;Moustafa;Mater. Lett.,2002
3. Processing of Cu–Al2O3 metal matrix nanocomposite materials by using high energy ball milling;Ying;Mater. Sci. Eng. A,2000
4. Mechanochemical synthesis of Cu–Al2O3 nanocomposites;Hwang;Mater. Sci. Eng. A,2005
5. Tensile and fatigue fracture of nanometric alumina reinforced copper with bimodal grain size distribution;Simchi;Mater. Sci. Eng. A,2009
Cited by 64 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Extending the upper limit of volumetric fraction of oxides in ODS-Cu fabricated with internal oxidation via element doping;Journal of Alloys and Compounds;2024-10
2. Improved strength-plasticity-conductivity of graphene/copper layered composites by vacuum hot rolling;Journal of Materials Research and Technology;2024-07
3. Arc erosion resistance of Al2O3–Cu/35Mo composites reinforced by trace graphene oxide;Journal of Materials Research and Technology;2024-05
4. Enhanced combination of strength and electrical conductivity properties with CrB2 reinforced Cu matrix composites fabricated by powder metallurgy;Materials Today Communications;2024-03
5. Effect of Copper Powder Addition on Microscopic Deformation Behavior of Al2O3/Cu‐Dispersion‐Strengthened Copper‐Sintered Billet;Advanced Engineering Materials;2024-02-22
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3