Enhancement of leaching copper by organic agents from waste printed circuit boards in a sulfuric acid solution-Reference-Cited by-同舟云学术

Enhancement of leaching copper by organic agents from waste printed circuit boards in a sulfuric acid solution

Published:2022-11 Issue: Volume:307 Page:135924
ISSN:0045-6535
Container-title:Chemosphere
language:en
Short-container-title:Chemosphere

Author:

He Jingfeng,Zhang Mingming,Chen Hao,Guo Shulian,Zhu Lingtao,Xu Jiang,Zhou Kui

Publisher

Elsevier BV

Subject

General Medicine,General Chemistry,Environmental Chemistry,Environmental Engineering,Pollution,Health, Toxicology and Mutagenesis,Public Health, Environmental and Occupational Health

Reference61 articles.

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3. Kinetics of chalcopyrite dissolution by hydrogen peroxide in sulphuric acid;Antonijević;Hydrometallurgy,2004

4. Dissolution kinetics of sphalerite with hydrogen peroxide in sulphuric acid medium;Aydogan;Chem. Eng. J.,2006

5. Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery;Birloaga;Waste Manag.,2013

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