Electrical Resistivity Modification of Electrodeposited Mo and Mo–Co Nanowires for Interconnect Applications-Reference-Cited by-同舟云学术

Electrical Resistivity Modification of Electrodeposited Mo and Mo–Co Nanowires for Interconnect Applications

Published:2023-10 Issue: Volume: Page:
ISSN:2095-8099
Container-title:Engineering
language:en
Short-container-title:Engineering

Author:

Moon Jun Hwan,Kim Taesoon,Lee Youngmin,Kim Seunghyun,Kim Yanghee,Ahn Jae-Pyoung,Choi Jungwoo,Lee Hyuck Mo,Kim Young Keun

Publisher

Elsevier BV

Subject

General Engineering,Energy Engineering and Power Technology,Materials Science (miscellaneous),General Chemical Engineering,Environmental Engineering,General Computer Science

Reference48 articles.

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5. Mont FW, Zhang X, Wang W, Kelly JJ, Standaert TE, Quon R, et al. Cobalt interconnect on same copper barrier process integration at the 7nm node. In: Proceedings of the 2017 IEEE International Interconnect Technology Conference (IITC); 2017 May 16–18; Hsinchu, China. Piscataway: IEEE; 2017. p. 1–3.

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