Thermal transport mechanism of AlN/SiG/3C–SiC typical heterostructures
Author:
Publisher
Elsevier BV
Subject
Physics and Astronomy (miscellaneous),Energy (miscellaneous),General Materials Science
Reference58 articles.
1. Light emitting diodes reliability review;Chang;Microelectron. Reliab.,2012
2. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014
3. A roadmap for graphene;Novoselov;Nature,2012
4. The impact of interlayer rotation on thermal transport across graphene/hexagonal boron nitride van der waals heterostructure;Ren;Nano Lett.,2021
5. Reducing Kapitza resistance between graphene/water interface via interfacial superlattice structure;Peng;Nanotechnology,2022
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