Author:
Pospischil M.,Klawitter M.,Kuchler M.,Jahn M.,Efinger R.,Schwarz R.,Wende L.,König M.,Clement F.,Biro D.
Reference17 articles.
1. J. Specht, et al., “High aspect ratio front contacts by single step dispensing of metal pastes,” in 25th EU-PVSEC Valencia, Spain, 2010, pp. 1867-70.
2. 20% efficient passivated large-area metal wrap through solar cells on boron-doped cz silicon;Lohmüller;IEEE Electron Device Letters,2011
3. Paste Rheology Correlating With Dispensed Finger Geometry;Pospischil;IEEE JPV,2014
4. Dispensing Technology on the Route to an Industrial Metallization Process;Pospischil;Energy Procedia,2015
5. Analysis and Performance of Dispensed and Screen Printed Front Side Contacts at Cell and Module Level;Rodriguez;in 31st EU PVSEC Hamburg,2015
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