Influence of the Chemicals Used in Nickel and Copper Plating Solutions on the Adhesion of Screen-printed Silver Contacts-Reference-Cited by-同舟云学术

Influence of the Chemicals Used in Nickel and Copper Plating Solutions on the Adhesion of Screen-printed Silver Contacts

Published:2013 Issue: Volume:38 Page:753-759
ISSN:1876-6102
Container-title:Energy Procedia
language:en
Short-container-title:Energy Procedia

Author:

Kraft Achim,Ni Limeng,Kalio Andre,Moldovan Anamaria,Bartsch Jonas,Glatthaar Markus,Glunz Stefan W.

Publisher

Elsevier BV

Reference3 articles.

1. Progress with multi -step metallization process featuring copper as conducting layer at Fraunhofer ISE;Bartsch;Proc. of 27th EU PVSEC, Frankfurt Germany,2012

2. Analysis of chemical stability of printing pastes in electrochemical plating solutions;Wendling;Proc. of 2nd Silicon PV, Leuven, Belgium,2012

3. Joseph A. Pask et. al. Fundamentals of glass-to-metal bonding VIII: Nature of wetting and adherence, Journal of the American Ceramic Society Vol. 45, No.12.

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