Durability of Silicone Electrically Conductive Adhesive in Metal Wrap-through Module-Reference-Cited by-同舟云学术

Durability of Silicone Electrically Conductive Adhesive in Metal Wrap-through Module

Published:2013 Issue: Volume:38 Page:482-487
ISSN:1876-6102
Container-title:Energy Procedia
language:en
Short-container-title:Energy Procedia

Author:

Beaucarne Guy,Zambova Adriana,Broek Kees,Albaugh John,Chislea Brian,Wei Jason,Meerendré Thibault Kervyn de,Kloos Mario,Bennett Ian

Publisher

Elsevier BV

Reference4 articles.

1. Eerenstein W, Bennett I, Veldman D, Visser T, Brockholz B, de Jong PC, Copetti CA, Wijnen P, “Climate chamber test results of MWT back contact modules”, in Proceedings 25th European Photovoltaic Solar Energy Conference, Valencia, Spain, 2010.

2. Verschoor B, Bakker J, “(R)evolution of MWT module production”, 4th MWT Workshop, Amsterdam, The Netherlands, 2012.

3. Zhang F, “MWT technology and its future”, 4th MWT Workshop, Amsterdam, The Netherlands, 2012.

4. Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA's);Lu;IEEE Trans. on El. Pack. Manuf,1999

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