Long-term and Annealing Stable, Solderable PVD Metallization with Optimized Al Diffusion Barrier-Reference-Cited by-同舟云学术

Long-term and Annealing Stable, Solderable PVD Metallization with Optimized Al Diffusion Barrier

Published:2015-08 Issue: Volume:77 Page:374-381
ISSN:1876-6102
Container-title:Energy Procedia
language:en
Short-container-title:Energy Procedia

Author:

Kumm Julia,Chacko Rony V.,Samadi Hassan,Hartmann Philip,Eberlein Dirk,Wolf Andreas

Publisher

Elsevier BV

Reference8 articles.

1. Continued Development of All-Back-Contact Silicon Wafer Solar Cells at ANU;Zin;Energy Procedia,2013

2. Metallization for High Efficiency Crystalline Silicon Solar Cells;Nekarda;Proceedings of the 34th IEEE Photovoltaic Specialists Conference,2009

3. Investigation of the effects of different annealing ambients on Ag/Al bilayers: Electrical properties and morphology;Malgas;J. Appl. Phys.,2001

4. Development of temperature-stable, solderable PVD rear metallization for industrial silicon solar cells;Kumm;28th European Photovoltaic Solar Energy Conference,2013

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