Author:
Würzner Sindy,Falke Annemarie,Buchwald Rajko,Möller Hans Joachim
Reference7 articles.
1. Diamond wire-sawn silicon wafers – from the lab to the cell production;Bidiville;Proc. 24th EU PVSEC,2009
2. Analysis of the sub-surface damage of mc- and cz-Si wafers sawn with diamond-plated wire;Buchwald;Energy Procedia,2013
3. Nondestructive measurement of machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy;Yan;Precision Engineering,2008
4. E DIN EN ISO 25178-3:2008-03 /prEN ISO 25178-3:2008 (D). Geometrische Produktspezifikation (GPS) – Oberflächenbeschaffenheit: Flächenhaft – Teil 3: Spezifikationsoperatoren (Entwurf Juli 2008).
5. Laue scanner: A new method for determination of grain orientations and grain boundary types of multicrystalline silicon on a full wafer scale;Lehmann;Acta Materialia,2014
Cited by
33 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献