Effect of impurities on the electronic structure of grain boundaries and intergranular cohesion in tungsten-Reference-Cited by-同舟云学术

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Effect of impurities on the electronic structure of grain boundaries and intergranular cohesion in tungsten

Published:1993-01 Issue:5 Volume:12 Page:251-260
ISSN:0263-4368
Container-title:International Journal of Refractory Metals and Hard Materials
language:en
Short-container-title:International Journal of Refractory Metals and Hard Materials

Author:

Krasko Genrich L.

Publisher

Elsevier BV

Subject

General Medicine

Reference41 articles.

1. Embrittlement of Engineering Alloys,1983

2. Interfacial Segregations,1979

3. Role of the grain boundaries in the ductile-brittle transition behavior of BCC refractory metals;Meyers;Trans. Metall. Soc. AIME,1965

4. Intergranular brittleness studies in tungsten using Auger spectroscopy;Joshi;Metall. Trans.,1970

5. Solute segregations and grain boundary embrittlement of tungsten;Smith,1973

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1. Phosphorus driven embrittlement and atomistic crack behavior in tungsten grain boundaries;Computational Materials Science;2024-09

2. Laser powder bed fusion additive manufacturing of molybdenum using a nitrogen build atmosphere;International Journal of Refractory Metals and Hard Materials;2024-02

3. Microstructure and Elevated Temperature Flexure Testing of Tungsten Produced by Electron Beam Additive Manufacturing;JOM;2023-08-30

4. Atomistic investigation of the impact of phosphorus impurities on the tungsten grain boundary decohesion;Computational Materials Science;2023-02

5. Effects of Cu and Fe on cohesion and brittleness of grain boundary of tungsten;Journal of Physics and Chemistry of Solids;2022-06

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