Numerical study of bottom-wall temperature modulation effects on thermal instability and oscillatory cellular convection in a rectangular enclosure
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference28 articles.
1. Natural convection in enclosures;Ostrach;ASME J. Heat Transfer,1988
2. Transitions and bifurcations in laminar buoyant flows in confined enclosures;Yang;ASME J. Heat Transfer,1988
3. Unsteady natural convection in a rectangular cavity;Patterson;J. Fluid Mech.,1980
4. Transient cooling by natural convection in a two-dimensional square enclosure;Nicollete;Int. J. Heat Mass Transfer,1985
5. Transition flow in a side-heated cavity at high Rayleigh number: a numerical study;Schladow;J. Fluid Mech.,1989
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Forced Convection during Cooling of Power Supply Box using Pulsation Flow with Piezoelectric Fan;IEEJ Transactions on Electrical and Electronic Engineering;2023-04-04
2. A fourth-order compact difference algorithm for numerical solution of natural convection in an inclined square enclosure;Numerical Heat Transfer, Part A: Applications;2021-07-19
3. Lattice Boltzmann simulation of natural convection in a cavity with periodic boundary condition on both side walls;International Journal of Modern Physics C;2021-07-16
4. Critical role of Prandtl number on multiple steady states during natural convection in square enclosures: Analysis of heat transfer rates, flow and thermal maps;International Journal of Heat and Mass Transfer;2021-05
5. Time-Periodic Cooling of Rayleigh–Bénard Convection;Fluids;2021-02-16
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3