A new model for heat transfer of fins swinging back and forth in a flow

Author:

Fu Wu-Shung,Yang Suh-Jenq

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference25 articles.

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4. A review of recent developments in some practical aspects of air-cooled electronic packages;Sathe;J. Heat Transfer,1998

5. New development in cooling techniques;Markstein;Electron. Packaging Production,1975

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3. Enhancement of heat transfer coefficients by actuation against an impinging jet;International Journal of Heat and Mass Transfer;2012-07

4. Literature Survey of Numerical Heat Transfer (2000–2009): Part I;Numerical Heat Transfer, Part A: Applications;2010-03-16

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