1. Hexcel Data Sheets, Hexcel Co., Pleasanton, CA, 1998.
2. T.J. Lu, H.A. Stone, M.F. Ashby, Heat transfer in open-cell metal foams, Acta mater. 46 (1998) 3619–3635.
3. A.F. Bastawros, A.G. Evans, Characterisation of open-cell aluminium alloy foams as heat sinks for high power electronic devices, in: Proceedings of the Symposium on the Application of Heat Transfer in Microelectronics Packaging, IMECE, Dallas, Texas, 1997.
4. A.F. Bastawros, A.G. Evans, H.A. Stone, Evaluation of cellular metal heat dissipation media, Harvard University, Division of Engineering and Applied Sciences Report MECH-325, Cambridge, MA 02138, U.S.A., 1998, to be published.
5. J.S. Goodling, Microchannel heat exchangers, in: A.M. Khounsary (Ed.) , High Power Flux Engineering II, SPIE Conf. Proc., 1997.