Numerical study of a buoyancy-induced flow along a vertical plate with discretely heated integrated circuit packages

Author:

Wang H.Y.,Penot F.,Sauliner J.B.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference17 articles.

1. Thermally optimum spacing of vertical, natural convection cooled, parallel plates;Bar-cohen;Heat Transfer In Electronic Equipment,1981

2. Natural convection heat transfer characteristics of simulated microelectronic chips;Park;International Journal of Heat Transfer,1987

3. Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic components;Sparrow;International Journal of Heat Transfer,1983

4. Buoyancy induced convection in a non-uniformly heated array of cubical elements on a vertical channel wall;Ortega;Heat Transfer In Electronic Equipment,1986

5. Heat transfer characteristics of an array of protruding elements in single phase forced convection;Garimella;International Journal of Heat and Mass Transfer,1990

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