Three-dimensional transient cooling simulations of a portable electronic device using PCM (phase change materials) in multi-fin heat sink

Author:

Wang Yi-Hsien,Yang Yue-Tzu

Publisher

Elsevier BV

Subject

General Energy,Pollution,Mechanical Engineering,Building and Construction,Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Civil and Structural Engineering

Reference30 articles.

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3. Merits of employing foam encapsulated phase change materials for pulsed power electronics cooling applications;Lafdi;J Electronic Packaging,2008

4. Humphries W, Griggs E. A design handbook for phase change thermal control and energy storage devices. NASA Technical Paper 1074 NASA Scientific and Technical Information Office; 1977.

5. Experimental study on liquid/solid phase change for cold energy storage of liquefied natural gas (LNG) refrigerated vehicle;Hongbo;Energy,2010

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