Coupling dynamic thermal analysis and surface modification to enhance heat dissipation of R410A spray cooling for high-power electronics-Reference-Cited by-同舟云学术

Coupling dynamic thermal analysis and surface modification to enhance heat dissipation of R410A spray cooling for high-power electronics

Published:2023-12 Issue: Volume:284 Page:129224
ISSN:0360-5442
Container-title:Energy
language:en
Short-container-title:Energy

Author:

Wang Shangming,Zhou Zhifu,Sang Xuehao,Chen Bin^ORCID,Romeos Alexandros^ORCID,Giannadakis Athanasios^ORCID,Thrassos Panidis^ORCID

Funder

Ministry of Science and Technology of the People's Republic of China

Fundamental Research Funds for the Central Universities

International Science and Technology Cooperation Programme

Publisher

Elsevier BV

Subject

General Energy,Pollution,Mechanical Engineering,Building and Construction,Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Civil and Structural Engineering

Reference49 articles.

1. Review on high heat flux flow boiling of refrigerants and water for electronics cooling;Parizad Benam;Int J Heat Mass Tran,2021

2. A review of the capabilities of high heat flux removal by porous materials, microchannels and spray cooling techniques;Smakulski;Appl Therm Eng,2016

3. Prospects of heat transfer approaches to dissipate high heat fluxes: opportunities and challenges;Sefiane;Appl Therm Eng,2022

4. A review on experimental and numerical investigations of jet impingement cooling performance with nanofluids;Ooi;Micromachines,2022

5. Study on structure optimization of a dual IGBT module heat sink in a DC–DC converter under natural convection based on field synergy theory;Li;IEEJ Trans Electr Electron Eng,2019

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing data center cooling efficiency and ability: A comprehensive review of direct liquid cooling technologies;Energy;2024-11

2. Experimental study of dielectric liquid spray cooling on multi-scale structured surfaces inspired by leaf veins;International Journal of Heat and Fluid Flow;2024-10

3. Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management;Applied Thermal Engineering;2024-08

4. Numerical Investigations of the Cooling Performance of an R410A Closed-Loop Spray Cooling System;Energies;2024-01-09