Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Polymers and Plastics,Pollution,Waste Management and Disposal
Reference28 articles.
1. Growth of a Copper‐Gold Alloy Phase by Bulk Copper Electrodeposition on Gold Investigated by In Situ STM
2. Andricacos, P.C., et al., U.S. Patent 5,385,661; assignors to IBM Corp.
3. Bhagwat, A.W., and E.F. Riggenbach, U.S. Patent 5,437,748; assignors to Goodyear Tire & Rubber Co.
4. Giant Magnetoresistance in Electrodeposited Ni/Cu and Co/Cu Multilayers
5. Residual Stress Measurements in Electrolytic Copper‐Nickel Compositionally Modulated Multilayers
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献