Effect of diffusionally accommodated interfacial sliding on the stress and deformation in copper/polyimide high density interconnects
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Materials Science,Instrumentation
Reference13 articles.
1. Auman, B., 1995. DuPont Electronics, Wilmington, DE, private communication
2. The effect of grain-boundary deformation of copper on the creep micro-deformation of copper;Carolan;Acta Metallurgica,1992
3. The non-uniform flow of polycrystals by grain-boundary sliding accommodated by power-law creep;Crossman;Acta Metallurgica,1975
4. Experimental determination of the two dimensional state of stress and the orthotropic elasticity coefficients for coatings;Farris;Mater. Res. Soc. Symp. Proc.,1991
5. Effect of grain boundary sliding on steady creep of polycrystals;Gharemani;J. Solids Structures,1980
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The effect of temperature and strain rate on the periodic cracking of amorphous AlxOy films on Cu;Surface and Coatings Technology;2011-12
2. Effect of internal stresses on thermo-mechanical stability of interconnect structures in microelectronic devices;Materials Science and Engineering: A;2006-04
3. Modeling of interfacial sliding and film crawling in back-end structures of microelectronic devices;IEEE Transactions on Components and Packaging Technologies;2005-09
4. Deformation and interfacial sliding in back-end interconnect structures in microelectronic devices;Journal of Electronic Materials;2003-10
5. Interfacial Sliding in Back-End Interconnect Structures in Microelectronic Devices;MRS Proceedings;2002
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3