Use of organosolv lignin in phenol-formaldehyde resins for particleboard production-Reference-Cited by-同舟云学术

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Use of organosolv lignin in phenol-formaldehyde resins for particleboard production

Published:2002-01 Issue:6 Volume:22 Page:481-486
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Çetin Nihat S,Özmen Nilgül

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference14 articles.

1. Maloney TM. Modern particleboard and dry process manufacturing. San Francisco: Miller Freeman Inc.; 1993.

2. Desch HE, Dinwoodie JM. Timber. Its structure, properties and utilisation. Hong Kong: The Macmillan Press Ltd; 1993.

3. Humphrey PE. Physical aspects of wood particleboard manufacture. Ph.D. thesis, University of Wales, 1982.

4. Lignin and ligninsulfonate in non-conventional bonding—an overview

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1. Reduction of formaldehyde emission from urea-formaldehyde resin by maleated nanolignin;International Journal of Adhesion and Adhesives;2024-06

2. Lignin: A multi-faceted role/function in 3D printing inks;International Journal of Biological Macromolecules;2024-05

3. Surface characteristics of phenolic resin coatings;Surfaces and Interfaces;2024-02

4. Effect of Lignin or Lignosulfonate Addition on the Fire Resistance of Areca (Areca catechu) Particleboards Bonded with Ultra-Low-Emitting Urea-Formaldehyde Resin;Fire;2023-08-03

5. The Effect of Lignin on the Reactivity of Phenol-Formaldehyde Resin and Properties of a Thermal-Insulation Material Based on It;Polymer Science, Series D;2023-06

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