1. USP 5,242,637, E. Patent 0407 996.
2. USP 4,844,833, J. Patent 2,131,217 and 2,136,376.
3. Evaluation of adhesive properties of elastomeric adhesive. The development and utilization of the removable adhesive;Sakurai;Bulletin of Shizuoka Industrial Technology Research Center,1998
4. Ishikawa H. Development of bonding and debonding technology meeting recycle requirements. Proceedings of JSME Colloquium No. 01-86, 2001. p. 5–8 [in Japanese].
5. Hanafi M, Nishiyama Y, Sato C. Fracture mechanism of joints bonded by dismantlable adhesive including thermally expansive particles. Proceedings of EURADH 2002, Glasgow/UK, 2002. p. 133–6.