Solder deposition for transient liquid phase (TLP)-bonding by MSIP-PVD-process-Reference-Cited by-同舟云学术

Solder deposition for transient liquid phase (TLP)-bonding by MSIP-PVD-process

Published:2003-09 Issue: Volume:174-175 Page:704-707
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Lugscheider E.,Bobzin K.,Erdle A.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference8 articles.

1. Diffusion Soldering

2. Novel Application of Diffusion Soldering*

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4. Deposition of solder for microjoining on MEMS components by means of magnetron sputtering;Lugscheider;Surf. Coat. Technol.,2001

5. M.K. Lake, Einsatz der PVD-Technologie zur Applikation von Lotwerkstoffen für die Herstellung von mikrosystemtechnischen Fügeverbunden, Doctoral Thesis, RWTH Aachen, ISBN 3-89653-933-7

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3. Wafer Bonding;Reference Module in Materials Science and Materials Engineering;2016

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