A nanoindentation study of copper films on oxidised silicon substrates
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference18 articles.
1. A method for interpreting the data from depth-sensing indentation instruments
2. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments
3. Micro-hardness of annealed and work-hardened copper polycrystals
4. Measurement of mechanical properties by ultra-low load indentation
5. Soft films on hard substrates — nanoindentation of tungsten films on sapphire substrates
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