Si wafer surface cleaning using laser-induced shock wave: a new dry cleaning methodology-Reference-Cited by-同舟云学术

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Si wafer surface cleaning using laser-induced shock wave: a new dry cleaning methodology

Published:2003-06 Issue: Volume:169-170 Page:178-180
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Lee S.H.,Park J.G.,Lee J.M.,Cho S.H.,Cho H.K.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference2 articles.

1. UV ozone cleaning of silicon substrates in silicon molecular beam epitaxy

2. Removal of small particles on silicon wafer by laser-induced airborne plasma shock waves

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1. The Fundamental Mechanisms of Laser Cleaning Technology and Its Typical Applications in Industry;Processes;2023-05-10

2. Progress in applications of shockwave induced by short pulsed laser on surface processing;Optics & Laser Technology;2023-01

3. Laser cleaning and Raman analysis of the contamination on the optical window of a rubidium vapor cell;Scientific Reports;2022-09-15

4. Theoretical simulation of laser-supported absorption wave induced by millisecond-nanosecond combined-pulse laser on silicon;AOPC 2021: Advanced Laser Technology and Applications;2021-11-24

5. The quality improvement of laser rubber removal for laminated metal valves;Optics & Laser Technology;2021-07

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