Modelling the effect of complex waveform on surface finishing in pulse current electroforming of nickel-Reference-Cited by-同舟云学术

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Modelling the effect of complex waveform on surface finishing in pulse current electroforming of nickel

Published:2000-12 Issue:1 Volume:135 Page:91-97
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Wong K.P,Chan K.C,Yue T.M

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference28 articles.

1. Modern Electroforming

2. P.M. Umer, R.I. Altkorn, R.H. Haidle, W.D. Madsen, Proceeding of SPIE—The International Society for Optical Engineering, 2279 (1994) 56.

3. K.P. Wong, MSc Dissertation, The Hong Kong Polytechnic University, (1998).

4. S.A. Watson, NiDI Technical Series No.10051, Nickel Develpment Institute, Toronto, Ontario, Canada, (1989).

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1. Fabrication of void-free submillimeter-scale nickel component by bottom-up electrodeposition;Journal of Physics Communications;2021-02-01

2. Advances in precision micro/nano-electroforming: a state-of-the-art review;Journal of Micromechanics and Microengineering;2020-08-20

3. Design and manufacture of structured surfaces by electroforming;Procedia Manufacturing;2017

4. Electrochemical Deposition and Mechanical Property Enhancement of the Nickel and Nickel-Cobalt Films;Handbook of Manufacturing Engineering and Technology;2014-09-30

5. References;Periodic Operation of Chemical Reactors;2013

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