Fabrication and crystallization behaviors of sputtered Ni–Cu–P films on tool steel-Reference-Cited by-同舟云学术

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Fabrication and crystallization behaviors of sputtered Ni–Cu–P films on tool steel

Published:2001-05 Issue:2-3 Volume:139 Page:233-243
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Chang Ying-Chan,Duh Jenq-Gong,Chen Yung-I

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference30 articles.

1. Studies on crystallization of electroless NiP deposits

2. Electroless Plating: Fundamentals and Applications, Chap. 4;Mallory,1990

3. Metal Handbook, Ninth ed., Vol. 5, American Society for Metals, (1983) 219–243.

4. The Deposition and Crystallization Behaviors of Electroless Ni‐Cu‐P Deposits

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