Evaluation of the mechanical properties of thin metal films
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference7 articles.
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4. Determination of yielding and debonding in Al–Cu thin films from residual stress measurements via diffraction;Shute;J. Mater. Res.,1991
5. Comparison of mechanical properties and microstructure of Al (1 wt.%Si) and Al (1 wt.%Si, 0.5 wt.%Cu);Bader;Thin Solid Films,1995
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