Plasma cleaning of copper leadframe with Ar and Ar/H2 gases-Reference-Cited by-同舟云学术

Plasma cleaning of copper leadframe with Ar and Ar/H2 gases

Published:1999-02 Issue:1-3 Volume:112 Page:245-249
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Hsieh J.H.,Fong L.H.,Yi S.,Metha G.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference8 articles.

1. Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling

2. C.T. Chong, A. Leslie, T.B. Lim, C. Lee, IEEE Proc. 45th Electronics Components and Technology Conf., 1995, pp. 463–469.

3. L.J. Matienzo, F.D. Egitto, Solid State Technol. July (1995) 99–105.

4. Hydrogen plasma chemical cleaning of metallic substrates and silicon wafers

5. N. Onda, A. Dommann, H. Zimmermann, J. Ramm, Semicon 96, Technical Conf. Proc., Singapore, Semiconductor Equipment and Materials International, Mountain View, CA, 1996.

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