Ductile Fracture by Void Growth to Coalescence
Author:
Publisher
Elsevier
Reference199 articles.
1. Achon, P. (1994). Comportement et ténacité d’alliages d’aluminium à haute résistance. Ph.D. thesis, Ecole des Mines de Paris.
2. Anisotropy of intermetallic particle cracking damage evolution in an Al-Mg-Si base wrought aluminum alloy under uniaxial compression;Agarwal;Metallurgical and Materials Transactions A,2002
3. Formation of Cavities from Nondeformable Second–Phase Particles in Low Temperature Ductile Fracture;Argon;Journal of Engineering Materials and Technology,1976
4. Separation of Second Phase Particles in Spheroidized 1045 Steel, Cu-0.6pct Cr Alloy, and Maraging Steel in Plastic Straining;Argon;Metallurgical Transactions,1975
5. Cavity Formation from Inclusions in Ductile Fracture;Argon;Metallurgical Transactions,1975
Cited by 514 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A homogenization-based model of the Gurson type for porous metals comprising randomly oriented spheroidal voids;European Journal of Mechanics - A/Solids;2024-05
2. Effect of non-uniform void distributions on the yielding of metals;Computer Methods in Applied Mechanics and Engineering;2024-03
3. Coupling a void growth model with an elastoplastic material model for a simultaneous prediction of the borehole plastic zone and critical collapse pressure;Geoenergy Science and Engineering;2024-02
4. Yield criterion for intergranular void coalescence under combined tension and shear;International Journal of Plasticity;2024-02
5. Experimental and numerical investigation of ductile fracture of K418 on in‐situ tensile tests;Fatigue & Fracture of Engineering Materials & Structures;2024-01-26
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3