On the phase transformation and dynamic stress–strain partitioning of ferrous medium-entropy alloy using experimentation and finite element method
Author:
Funder
Pohang University of Science and Technology
Publisher
Elsevier BV
Subject
General Materials Science
Reference71 articles.
1. Nanostructured high-entropy alloys with multiple principal elements: novel alloy design concepts and outcomes;Yeh;Adv. Eng. Mater.,2004
2. Microstructural development in equiatomic multicomponent alloys;Cantor;Mater. Sci. Eng. A,2004
3. Microstructure and room temperature properties of a high-entropy TaNbHfZrTi alloy;Senkov;J. Alloy Compd.,2011
4. A fracture-resistant high-entropy alloy for cryogenic applications;Gludovatz;Science,2014
5. Alloy design and properties optimization of high-entropy alloys;Zhang;JOM,2012
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