Correlations between dislocation density evolution and spall strengths of Cu/Ta multilayered systems at the atomic scales: The role of spacing of KS interfaces-Reference-Cited by-同舟云学术

Correlations between dislocation density evolution and spall strengths of Cu/Ta multilayered systems at the atomic scales: The role of spacing of KS interfaces

Published:2019-03 Issue: Volume:5 Page:100192
ISSN:2589-1529
Container-title:Materialia
language:en
Short-container-title:Materialia

Author:

Chen J.,Mathaudhu S.N.,Thadhani N.,Dongare A.M.^ORCID

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

General Materials Science

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