Sinterability and conductivity of silver paste with Pb-free frit
Author:
Publisher
Elsevier BV
Subject
General Physics and Astronomy,General Materials Science
Reference5 articles.
1. A method of adhesion strength test for thick film
2. Effects of surfactant treatment of silver powder on the rheology of its thick-film paste
3. A new and effective chemical reduction method for preparation of nanosized silver powder and colloid dispersion
4. Influence of surfactants treatment on silver powder and its thick films
5. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material
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