A study on the dry etching characteristics of indium gallium zinc oxide and molybdenum by the CCP-RIE system for the 4 mask process
Author:
Publisher
Elsevier BV
Subject
General Physics and Astronomy,General Materials Science
Reference16 articles.
1. Material characteristics and applications of transparent amorphous oxide semiconductors
2. Enhanced Via Integration Process for Copper/Ultralow- $k$ Interconnects
3. Improvements in the device characteristics of amorphous indium gallium zinc oxide thin-film transistors by Ar plasma treatment
4. Local coordination structure and electronic structure of the large electron mobility amorphous oxide semiconductor In-Ga-Zn-O: Experiment andab initiocalculations
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1. Origin of the High Density of Oxygen Vacancies at the Back Channel of Back-Channel-Etched a-InGaZnO Thin-Film Transistors;Micromachines;2024-03-16
2. Plasma atomic layer etching of molybdenum with surface fluorination;Applied Surface Science;2023-08
3. Highly Selective Plasma Etching Technique for Molybdenum;Plasma Chemistry and Plasma Processing;2023-02-18
4. Low-temperature plasma atomic layer etching of molybdenum via sequential oxidation and chlorination;Journal of Vacuum Science & Technology A;2022-03
5. Performance and Stability Improvements of Back-Channel-Etched Amorphous Indium–Gallium–Zinc Thin-Film-Transistors by CF4+O2 Plasma Treatment;IEEE Electron Device Letters;2015-09
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