Author:
Post Daniel,Han Bongtae,Ifju Peter G.
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2. Mapping of deformation caused by moisture change using moiré interferometry;Wood;Dent Mat,1999
3. Solder bumped flip chip attach on SLC board and multichip module;Tsukada,1994
Cited by
3 articles.
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1. Elastic-plastic strain distributions at fillet welds;The Journal of Strain Analysis for Engineering Design;1996-05-01
2. An assessment of frozen stress photoelasticity;The Journal of Strain Analysis for Engineering Design;1992-07-01
3. Application of moiré interferometry to a contact problem;The Journal of Strain Analysis for Engineering Design;1990-10-01