Author:
Kang Shung-Wen,Tsai Sheng-Hong,Chen Hong-Chih
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference6 articles.
1. Thermal performance challenges from silicon to systems;Viswanath;Intel Technology Journal Q,2000
2. T.P. Cotter, Principles and prospects for micro heat pipe, in: Proceedings of the 5th International Heat Pipe Conference, Tsukuba, Japan, 1984, pp. 328–335
3. Fundamentals of Microfabrication;Madou,1997
4. A.-L. Tiensuu, J.-Å. Schweitz, S. Johansson, In situ investigation of precise high strength micro assembly using Au–Si eutectic bonding, in: Proceedings of the 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, 1995, pp. 236–239
5. Assembling three-dimensional microstructures using gold–silicon eutectic bonding;Tiensuu;Sensors and Actuators A: Physical,1994
Cited by
68 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献