Packaging and cooling problems associated with microelectronics equipment-Reference-Cited by-同舟云学术

Packaging and cooling problems associated with microelectronics equipment

Published:1969-11 Issue:4 Volume:8 Page:331-337
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Honnor F.,Thomas M.A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Heat Transmission;McAdams,1954

2. Thermal design considerations in microcircuits;Baum,1967

3. Thermal considerations for hybrid microcircuit packages and assemblies with high power dissipation;Chu,1968

4. Dielectric bath promoter togetherness in I.C's;Weirather;Electronics,1967

5. Cooling of micro electronics;Honnor,1968

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