Thin film circuits—Part III. Engineering a microcircuit module-Reference-Cited by-同舟云学术

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Thin film circuits—Part III. Engineering a microcircuit module

Published:1964-06 Issue:1 Volume:3 Page:25-34
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Manfield H.G.,Letchford A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. The Uses of Photomechanical Processes in the Manufacture of Microminiature Circuits;Manfield;Electron. Engng.,1963

2. The Development of Thin Film Resistors and Capacitors for Microminaturisation;Manfield;Electron. Engng.,1963

3. Microminiaturisation—Proceedings of the AGARD Conference;Dummer,1962

4. Thermocompression Bonding to Microcircuits;Phillips;Brit. Commun. Electron.,1963

5. Circuit Considerations Relating to Microelectrics;Suran,1961

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A tuned microelectronic amplifier using thin films;Microelectronics Reliability;1965-09

2. A history of microelectronics development at the Royal Radar Establishment;Microelectronics Reliability;1965-06

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