Bond strengths and remnant adhesive resin on debonding for orthodontic bonding techniques
Author:
Publisher
Elsevier BV
Subject
Orthodontics
Reference31 articles.
1. Enamel surface appearance after various debonding procedures;Zachrisson;Am J Orthod,1979
2. Enamel loss due to orthodontic bonding with filled and filled resins using various clean-up techniques;Pus;Am J Orthod,1980
3. Enamel loss due to prophylaxis and multiple bonding debonding of orthodontic attachments;Thompson;Am J Orthod,1981
4. Enamel alterations from bracket bonding and debonding: a study with the scanning electron microscope;Diedrich;Am J Orthod,1981
5. A comparison of enamel detachments after debonding between Unitek's “Dynalock” bracket and a foil-mesh bracket: a scanning electron microscope study;Meister;Am J Orthod,1985
Cited by 31 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. An in Vitro Comparison of The Shear Bond Strength of Human Teeth to Bovine Teeth in The Bonding Orthodontic Brackets;مجلة الجامعة الأسمرية;2023-02-27
2. Comparison of shear bond strength of rebonded brackets prepared with different methods of resin removal: an in vitro study;Folia Medica;2022-12-31
3. A comparative study of shear bond strength of four different light cure orthodontic adhesives: An in vitro study;Journal of Contemporary Orthodontics;2022-09-15
4. Shear Bond Strength of the Metal Bracket to Zirconium Ceramic Restoration Treated by the Nd: YAG Laser and Other Methods: An In Vitro Microscopic Study;Journal of Lasers in Medical Sciences;2020-10-03
5. Time-dependent effects after enamel fluoride application on an acid etching system in orthodontic bracket bonding;Clinical Oral Investigations;2020-06-18
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3