Optimizing the deformation behavior of stent with nonuniform Poisson's ratio distribution for curved artery
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,Biomedical Engineering,Biomaterials
Reference34 articles.
1. Current treatment of in-stent restenosis;Alfonso;J. Am. Coll. Cardiol.,2014
2. Carotid artery stenting simulation: from patient-specific images to finite element analysis;Auricchio;Med. Eng. Phys.,2011
3. Physical principles of circulatory phenomena: the physical equilibria of the heart and blood vessels;Burton;Handb. Physiol. Sect.,1962
4. Results of percutaneous transluminal angioplasty of high-risk angulated;Ellis;Am. J. Cardiol.,1990
5. Conformability in everolimus-eluting bioresorbable scaffolds compared with metal platform coronary stents in long lesions;Fam;Int. J. Cardiovasc. Imaging,2017
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