Modified maximum tangential stress criterion for fracture behavior of zirconia/veneer interfaces
Author:
Funder
Zachry Department of Civil Engineering at Texas A&M University
Publisher
Elsevier BV
Subject
Mechanics of Materials,Biomedical Engineering,Biomaterials
Reference24 articles.
1. Analysis of fracture initiation angle in some cracked ceramics using the generalized maximum tangential stress criterion;Aliha;Int. J. Solid Struct.,2012
2. Experimental determination of stress field parameters in bi-material notches using photoelasticity;Ayatollahi;Mater. Des.,2011
3. Evaluation of first non-singular stress term in bi-material notches;Ayatollahi;Comput. Mater. Sci.,2010
4. On the interfacial fracture of porcelain/ zirconia and graded zirconia;Chai;Acta Biomater.,2014
5. A test specimen for determining the fracture resistance of bimaterial interfaces;Charalambides;J. Appl. Mech.,1989
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