Plastic deformation in electrical conductors subjected to short-duration current pulses
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Materials Science,Instrumentation
Reference21 articles.
1. Finite deformations of metal cylinders subjected to electromagnetic fields and mechanical forces;Bilyk;Journal of the Mechanics and Physics of Solids,2005
2. Effect of strain rate on the electroplastic effect in Nb;Cao;Scripta Metallurgica,1989
3. Thermally activated plastic flow of metals and ceramics with an electric field or current;Conrad;Materials Science and Engineering,2002
4. The electron drags on mobile dislocations in copper and aluminum at low temperatures-strain rate, temperature and field dependence;Galligan;Journal of Applied Physics,1979
5. Gallo, F., 2010. Effect of electro-mechanical loading in metallic conductors, Ph.D. Thesis, University of Texas at Austin.
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Mechanism of Electropulsing Treatment Technology for Flow Stress of Metal Material: A Review;Alloys;2024-03-21
2. An electroplastic constitutive model of fcc metals and their alloys under high current density;Mechanics of Materials;2024-02
3. Modified constitutive models for Inconel 718 considering current density and temperature in electrically assisted forming process;Chinese Journal of Aeronautics;2024-02
4. Fracture Behavior of Droppers under Low Current Pulses and Stress Coupling Cyclic Fields;Journal of Materials Engineering and Performance;2022-12-13
5. Dislocation density based modelling of electrically assisted deformation process by finite element approach;International Journal of Mechanical Sciences;2022-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3