Slip zone model for interfacial failures of stiff film/soft substrate composite system in flexible electronics-Reference-Cited by-同舟云学术

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Slip zone model for interfacial failures of stiff film/soft substrate composite system in flexible electronics

Published:2014-12 Issue: Volume:79 Page:35-44
ISSN:0167-6636
Container-title:Mechanics of Materials
language:en
Short-container-title:Mechanics of Materials

Author:

Chen Hang,Feng Xue,Chen Ying

Funder

National Natural Science Foundation of China

Tsinghua University Initiative Scientific0020Research Program

Publisher

Elsevier BV

Subject

Mechanics of Materials,General Materials Science,Instrumentation

Reference35 articles.

1. High-speed mechanically flexible single-crystal silicon thin-film transistors on plastic substrates;Ahn;IEEE Electron. Device Lett.,2006

2. Transfer printing techniques for materials assembly and micro/nanodevice fabrication;Carlson;Adv. Mater.,2012

3. Thermal stress in bonded joints;Chen;IBM J. Res. Device,1979

4. Directionally controlled transfer printing using micropatterned stamps;Chen;Appl. Phys. Lett.,2013

5. Experiments and viscoelastic analysis of peel test with patterned strips for applications to transfer printing;Chen;J. Mech. Phys. Solids,2013

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